By Prof. Yangdong Deng, Prof. Wojciech P. Maly (auth.)
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the idea that and value of three-dimensional (3-D) VLSI. The authors have constructed a brand new three-D IC integration paradigm, so-called 2.5-D integration, to handle many difficulties which are not easy to unravel utilizing conventional non-monolithic integration schemes. The e-book additionally introduces significant 3D VLSI layout matters that have to be solved by way of IC designers and digital layout Automation (EDA) builders. by way of treating 3-D integration in an built-in framework, the publication offers vital insights for semiconductor method engineers, IC designers, and people operating in EDA R&D.
Dr. Yangdong Deng is an affiliate professor on the Institute of Microelectronics, Tsinghua collage, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor on the division of electric and machine Engineering, Carnegie Mellon collage, USA.
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Extra info for 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
System module: a new chip-to-chip module technology. In: Proc. , 1997, pp. 439 442.  Matrix Semiconductor. 3-D technology. [online]. shtml.  Ziptronix Inc.. 3-D integration. [online]. com/.  P. Lindner, V. Dragoi, T. Glinsner, C. Schaefer, R. Islam. 3-D Interconnect through aligned wafer level bonding. In: Proc. , 2002, pp. 1439 1443. 5-Dimensional Integration Scheme  R. Islam, C. Rrubaker, P. Lindner, C. Schaefer. Wafer level packaging and 3-D interconnect for IC technology.
5-D integration. 5-D concept to a series of design cases studies. The designs under investigation are typical VLSI applications but each of them has a quite unique internal organization. Specifically, we will explore three important design attributes: geometrical characteristics of layout, timing performance, and system level throughput. 5-D integration strategy. 1 Crossbar Crossbar is a circuit element used as a switching network, which can be configured to connect any input channel to any output channel.
12 for Ct . 16) The drawing in Fig. 2 shows the trend of silicon areas when the input VLSI application is partitioned into four layers and implemented as 4 separate dies. Clearly, fabrication cost decrease very rapidly with the increasing of fault coverage level achieved by the system components. However, it is shown that a fault coverage level that is very close to 100% is not necessary due to the associated excessive testing cost. For the application under discussion, the cost minimum is achieved at a 90% fault coverage level.
3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme by Prof. Yangdong Deng, Prof. Wojciech P. Maly (auth.)